 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/16 datashee t tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 white led driver with synchronous boost converter and pwm brightness control for up to 3 leds in series BD6071HFN general description BD6071HFN is boost dc/dc converter possible to boost output voltage up to 14v (max.) and drive the white leds at constant. it is possible that turning on white led steadily by a series connection which has no current variation, and by a fast transient response with current mode. and, BD6071HFN is white led driver ic with synchronous rectification. with synchronous rectification (no external schottky diode required) and small package, they can save mount space. features ? boost dc/dc converter ? adjustment of brightness by external pwm pulse ? possible to driving 3 leds ? soft start function ? synchronous rectification boost dc/dc converter ? no external schottky diode required ? output open short protect typical application circuit key specifications ? operating power supply voltage range: 2.7v to 5.5v ? switching frequency: 1mhz(typ.) ? quiescent current: 0.1 a (typ.) ? operating temperature range: -30c to +85c package w(typ.) x d(typ.) x h(max.) applications this driver is applicable for various fields such as mobile phones, portable game machines, inter-phone camera, audio player, portable dvd player, back light for printer display etc and support light of the camera for the mobile phone, simple flash. and, these can use power supply for oel. pin configuration [top view] hson8 2.90mm x 3.00mm x 0.60mm 8 76 5 1 2 3 4 figure 1. pin configuration hson8 (top view) BD6071HFN cin 1 f vout vfb test en gnda gnd l 22 h cout 1 f rfb 24 ? white led vin sw vin downloaded from: http:///
2/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 absolute maximum ratings (ta=25c) parameter symbol ratings unit conditions terminal voltage 1 vmax1 7 * 1 v applicable to vin,en,vfb, test pins terminal voltage 2 vmax2 20 * 1 v applicable to sw,vout pins power dissipation pd 630 * 2 mw 70mm70mm1.6mm at glass epoxy board mounting operating temperature ran ge topr -30 ~ +85 c storage temperature range tstg -55 ~ +150 c *1 these values are based on gnd and gnda pins. *2 when its used by more than ta=25c, its reduced by 5.04mw/c. recommended operating ratings (ta=-30c to +85c) parameter symbol ratings unit conditions min. typ. max. operating supply voltage vin 2.7 3.6 5.5 v vin pin electrical characteristics (unless otherwise specified ta = +25c, vin = 3.6v) parameter symbol limits unit conditions min. typ. max. 3/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 pin descriptions pin name in/out pin number function gnda - 1 analog gnd en in 2 enable control(pull down is integrated on resistance) test in 3 test input (pull down is integrated on resistance) vin in 8 power supply input vfb in 4 feedback input voltage vout out 7 output sw in 6 switching terminal gnd - 5 power gnd thermal pad - - heat radiation pad of back side connect to gnda block diagram + + - osc control current sense q + - s q r tsd - + vin sw vout vfb test en gnda gnd 300k ? - + over voltage protect short protect pwm comp erramp q2 q1 downloaded from: http:/// 4/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 typical performance curves figure 5. efficiency vs. led current in each coil < 2led > (vout=7.5v, vin=3.6v, ta=25c) figure 2. current consumption vs. power source voltage vin [v] figure 3. quiescent current vs. power source voltage vin [v] figure 4. oscillation frequency vs. power source voltage vin [v] downloaded from: http:/// 5/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 typical performance curves - continued figure 7. efficiency vs. led current < 2led > (vout=7.5v, ta=25c) figure 8. efficiency vs. led current < 3led > (vout=10.5v, ta=25c) figure 6. efficiency vs. led current in each coil < 3led > (vout=10.5v, vin=3.6v, ta=25c) figure 9. inductor current limits vs. temperature temperature [c] downloaded from: http:/// 6/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 typical performance curves - continued figure 12. soft start ( vin = 3.6v, ta = 25c, 3led, 20ma load ) figure 13. led open output voltage figure 11. feedback voltage vs. power source voltage figure 10. output power vs. power source voltage output power [mw] downloaded from: http:/// 7/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 typical performance curves - continued figure 14. led luminance adjustment ( vin = 3.6v, ta = 25c, 3led, 20ma load ) downloaded from: http:/// 8/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 operation BD6071HFN is a fixed frequency pwm current mode dc/dc conv erter, and adopts synchronous rectification architecture (refer to the block diagram of p.3). as for the inputs of t he pwm comparator as the featur e of the pwm current mode, one is overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that controls the inductor current into slope waveform for sub harmo nic oscillation prevention. this output controls q1 and q2 via the rs latch. timing of q1 and q2 is precisely adjusted so that they wi ll not turn on at the same time, thus putting them into non-overlapped relation. in the period where q1 is on, energy is accumulated in the ex ternal inductor, and in the period where q1 is off, energy is transferred to the capacitor of vout via q2. further, BD6071HFN has many safety functions, and thei r detection signals stop switching operation at once. description of functions 1) soft starts and off status BD6071HFN has soft start function and off status function. the soft start function and the off status function prev ent large current from flowing to the ic via coil. occurrence of rush current at turning on is prevented by the soft start function, and occurrence of invalid current at turning off is prevented by the off status function. 2) isolation control BD6071HFN has isolation control to prevent led wrong lighting at power off. the cause of the led wrong lighting is leak current from vin to the white led. therefore, when BD6071HFN gets in power off (en = l), th e isolation control cuts the dc path between sw and vout, thereby the leak current from vin to led is prevented. figure 15. isolation control 3) short-circuit protection and over voltage protection BD6071HFN has short-circuit protection and over voltage prot ection. these detect the voltage of vout, and at error, they stop the output tr. details are as shown below. ? short-circuit protection in the case of short-circuit of the dc/dc output (vou t) to gnd, the coil or the ic may be destructed. therefore, at such an error as vout becoming 0.7v or below, the under detect or shown in the figure works, and turns off the output tr, and prevents the coil and the ic from being destructed. and the ic changes from its action condition into its non-acti on condition, and current does not flow to the coil (0ma). ? over voltage protection at such an error as the ic and the led being cut off, ov er voltage causes the sw terminal and the vout terminal exceed the absolute maximum ratings, and may destruct the ic. therefore, when vout becomes 14.5v or higher, the over voltage limit works, and turns off the output tr , and prevents the sw terminal and the vout terminal from exceeding the absolute maximum ratings. at this moment, the ic changes from its action condition in to its non action condition, and the output voltage goes down slowly. and, when the output voltage becomes the hysteresis of the over voltage limit or below, the output voltage goes on up to 14.5v once again. this protection action is shown in figure 16. f igure 16. block diagram of short-circuit protection and over voltage vin sw vout vfb white led vout over detecto r control under detecto r over voltage ref under voltage ref driver sw cout downloaded from: http:/// 9/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 4) thermal shut down BD6071HFN has thermal shut down function. the thermal shut down works at 175c or higher, and while ho lding the setting of en control from the outside, the ic changes from its action condition into its non action conditi on. and at 175c or below, the ic gets back to its normal action. start control and brightness control BD6071HFN can control the start conditions by its en terminal, and power off at 0.4v or below, and power on at 1.4v or higher. and by changing the duty of power on and of f by pwm control, the led brightness can be adjusted. two techniques are available for the brightness adjustmen t. one is discrete time (pwm) adjustment, and the other is continuous time adjustment. 1) pwm brightness adjustment is made by giving pwm signal to en as shown in figure 17. the BD6071HFN power on/off is according to the pwm signal. by this method, led current is controlled from 0 to the maximum current. the average led current increases in prop ortion with the duty cycle of pwm signal. while in pwm off-cycle mode, the ic and led both consume no currents, thus providing a high-efficiency operation. and please dont use duty less than 5% or more than 95% of current setting for the brightness adjustment because of the influence of turning on and off operating is large. t he recommended pwm frequency is 100hz ~ 300hz. figure 17. the brightness adjustment example of en terminal by pwm (f pwm = 100hz ~ 300hz) 2-1) the continuous time the brightness adjustment is made by giving dc contro l voltage to vfb pin of BD6071HFN via a series resistor as shown in figure 18. led luminance (current) changed by giving dc voltage to vfb directly. dc voltage is given from filtered one of dac signal, or pwm signal shown in figure 20. the advantage of this approach is that the pwm signal to be used to control the led brightness can be set to a high frequency (1khz or higher). and please dont use duty less than 5% or more than 95% of current setting for the brightness adjustment. led current (iled) is approximat ed by the following equation. iled = [{(vfb-dac) / r1} r2 + vfb ] / rfb vin sw vout en gnda test gnd vfb 22 h 1 f 24 ? 4.7k ? 22k ? vin dac r2 r1 rfb iled figure 18. the brightness adjustment example by dac figure 19. dac adjustment -5 0 5 10 15 20 25 30 0 0.5 1 1.5 2 2.5 3 3.5 4 1 1.5 2 2.5 3 3.5 4 3025 20 15 10 5 0 -5 0 0.5 iled [ma] dac [v] (vfb=500mv) vin sw vout en gnda test gnd vfb 22h 1f 24 ? vin pwm downloaded from: http:/// 10/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 2-2) the brightness adjustment of below is done in adjus ting of r2 on time by r1 and duty cycle of pwm. the minimum value of the led current is decided by vfb/r1 at the pwm 0%, the maximum value of the led current is decided by vfb/r1+vfb/r2 at the pwm 100%. iled is given as shown below. iled=vfb / r1 + vfb / r2 hi duty standard pwm frequency is 100hz~1khz. and please dont use dut y less than 5% or more than 95% of current setting for the brightness adjustment. figure 22. the brightness adjustment example of vfb terminal by pwm (f pwm =100hz ~ 1khz) vin sw vout en gnda test gnd vfb 22 h 1 f 30 ? 33k ? 47k ? 47nf 100k ? vin pwm iled 10khz 0 2.85v figure 20. the brightness adjustment example of vfb terminal by pwm (f pwm =10khz) 0 5 10 15 20 25 0 102030405060708090100 hi duty [%] iled [ma] figure 21. vfb pwm control vin sw vout en gnda test gnd vfb 22 h 1 f 47 ? vin 47 ? pwm 1khz r2 r1 0 5 10 15 20 25 0 10203040 5060708090100 hi duty [% ] iled [ma] figure 23. vfb pwm control downloaded from: http:/// 11/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 setting range of led current led current is determined by the voltage of vfb and the resistor connected to vfb terminal. iled is given as shown below. iled=vfb/rfb the current in the standard application is as shown below. vfb=0.5v, rfb=24 ? iled=20.8ma the shaded portion in the figure below is the setting range of led current to become the standar d. in case of using 2led, led current might increase due to over boosting when vout is less than 5.5v. therefore some ics may not be used at desired currents. consequently, for the proper setting of le d current, thoroughly check it for the suitability under use conditions including applicable power supply voltage and temperature. selection of external parts recommended external parts are as shown below. ? coil value tolerance manufacturer product number size (mm) dcr( ? ) w l h 22 h 10% murata lqh32cn220 k53 2.5 3.2 1.55 0.71 22 h 20% tdk vlf3012at220mr33 2.6 2.8 1.2 0.66 22 h 20% coil craft do1608 4.45 6.6 2.92 0.37 22 h 20% tdk vlf3010at220mr33 2.6 2.8 1.0 1.30 please refer to the reference data of p.4, p.5 for the change in the efficiency when the coil is changed. ? capacitor value manufacturer product number size (mm) temperature range l w h 12/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 112mvpp vout the coil is the part that is mo st influential to efficiency. select the coil wh ose direct current resist or (dcr) and current - inductance characteristic is excellent. the BD6071HFN is des igned for the inductance value of 22h. do not use other inductance value. select a capacitor of ceramic type with excellent frequency and temperat ure characteristics. further, select capacitor to be used for cin/cout with small direct current resistance, and pay sufficient attention to the pcb layout shown in the next page. pcb layout in order to make the most of the performance of this ic, its pc b layout is very important. characteristics such as efficiency and ripple and the likes change greatly with layout, which please note carefully. connect the input bypath capacitor cin nearest to between vin and gnda pin, as shown in the upper diagram. thereby, the input voltage ripple of the ic can be reduced. and, connect the output capacitor cout nearest to between vout and gnd pin. thereby, the output voltage ripp le of the ic can be reduced. connect t he current setting rfb nearest to vfb pin. connect the gnd connection side of rfb dire ctly to gnd pin. connect the gnda pin directly to gnd pin. when those pins are not connected directly near the ch ip, influence is given to the performanc e of BD6071HFN and may limit the current drive performance. as for the wire to the inductor, make it s resistance component small so as to reduce electric power consumption and increase the entire efficiency. and keep the pins that are subject to the influence like vfb pin away from the wire to sw. 13/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 recommended pcb layout front surface (top view) bottom surface (top view) figure 28. pcb layout attention point of pcb layout in pcb design, the wiring of power supply line should be low impedance, and put the bypass capacitor if necessary. especially the wiring impedance must be lower around the dc/dc converter. about heat loss in heat design, operate the dc/dc conver ter in the following condition. (the following temperature is a guarantee te mperature, so consider the margin.) 1. periphery temperature ta must be less than 85c. 2. the loss of ic must be less than dissipation pd. downloaded from: http:/// 14/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 operational notes 1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assum ed, consideration should be given to take physical safety measures including the use of fuses, etc. 2) operating conditions these conditions represent a range within which characteri stics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. 3) reverse connection of power supply connector the reverse connection of power supply connector can br eak down ics. take protective measures against the breakdown due to the reverse connection, such as mounti ng an external diode between the power supply and the ics power supply terminal. 4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and t he gnd lines. in this regard, for the digital block power supply and the analog block powe r supply, even though these po wer supplies has the same level of potential, separate the power supply pattern for the di gital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply an d the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. 5) gnd voltage make setting of the potential of the gnd terminal so that it will be mainta ined at the minimum in any operating state. furthermore, check to be sure no terminals are at a potenti al lower than the gnd voltage including an actual electric transient. 6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or t he gnd terminal, the ics can break down. 7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. 8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connec ted to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then di smount it from the jig. in addition, for protection against static electricity, establis h a ground for the assembly process and pay thorough attention to the transportation and t he storage of the set pcb. 9) input terminals in terms of the construction of ic, para sitic elements are inevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunct ion and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applie d to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a volt age lower than the power supply voltag e or within the guaranteed value of electrical characteristics. 10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large curr ent will cause no fluc tuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. 11) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant wi th consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. 12) thermal shutdown circuit (tsd) when junction temperatures become 175c (t yp.) or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolati ng the lsi from thermal runaway as much as possible, is not aimed at the protection or guar antee of the lsi. therefore, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. 13) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. 14) selection of coil select the low dcr inductors to decrease power loss for dc/dc converter. downloaded from: http:/// 15/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 ordering information b d 6 0 7 1 h f n - tr part number package hfn : hson8 packaging and forming specification tr: embossed tape and reel marking diagram physical dimensions tape and reel information status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. direction of feed reel ? order quantity needs to be multiple of the minimum quantity. 16/16 datasheet datasheet BD6071HFN ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0g3g0c200380-1-2 12.oct.2012 rev.001 revision history date revision changes 12.oct.2012 001 new release downloaded from: http:/// datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:/// datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:/// datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:/// |
Price & Availability of BD6071HFN
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |